Type I , Type II , Type III, Type IV, IPC6013, Mil- P-50884 and IPC6012 Type I, II and III
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Finished Min.Line Width
- Internal .003”
- External .004”
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Finished Min. Spacing
- Internal .003”
- External .004”
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Min Drilled Hole Size .008”
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Max. Aspect Ratio 15:1
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Min. Design Annular Ring .006
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Layer Count 30 plus (In production quantity environment)
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Max. Overall Thickness .250”
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Sheet Size
- 18x24 and 24x30 (standard)
- 24x36 and 24x48 (non standard)
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Double Treat Foil
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Min Dielectric (Flex) .0005
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Min. Dielectric (Rigid) .003
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Laser UV & CO2
- Skiving
- Profiling (+/-.002”) +/- .001”
- Micro Vias (.004" min)
- Copper Filled Vias
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Buried Vias (.008” hole)
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Blind Vias (sequential lamination) (.010” hole) .008”
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Sequential lamination 4 lamination cycles
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Via Fill
- Silver Epoxy (CB100)
- Resin Fill
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Impedance
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Reverse Pulse Plating
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Flying Probe ET
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Component Assembly (Thru hole & SMT, BGA, ESD, Conformal Coat)
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In-Circuit Test (Gen Rad) Flying Probe
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Environmental Test HASS and HALT
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Chassis Build
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Final Finishes HASL, ENIG and Electrolytic Gold
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Engineering Software Implemented “Genesis” Software ODB++ automation
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Certifications AS9100, IPC6013, IPC6012, MIL-P-50884, J-STD-001
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Multi-angle X-Ray (5 axis)
- XRT Drill/X-Ray system
Materials Used
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Rigid
- Epoxy (Fr4/High Tg FR4)
- Polyimide
- Isola
- Arlon
- Panasonic (Megtron 6)
- Rogers (4350, 4450)
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Flexible
- Dupont Pyralux Series (AP, FR, LF, HT, TK)
- Taconic (fastPrise EZ)
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