Our Capabilities

Type I , Type II , Type III, Type IV, IPC6013, Mil- P-50884 and IPC6012 Type I, II and III

  • Finished Min.Line Width

    • Internal .003”
    • External .004”
  • Finished Min. Spacing

    • Internal .003”
    • External .004”
  • Min Drilled Hole Size .008”

  • Max. Aspect Ratio 15:1

  • Min. Design Annular Ring .006

  • Layer Count 30 plus (In production quantity environment)

  • Max. Overall Thickness .250”

  • Sheet Size

    • 18x24 and 24x30 (standard)
    • 24x36 and 24x48 (non standard)
  • Double Treat Foil

  • Min Dielectric (Flex) .0005

  • Min. Dielectric (Rigid) .003

  • Laser UV & CO2

    • Skiving
    • Profiling (+/-.002”) +/- .001”
    • Micro Vias (.004" min)
    • Copper Filled Vias 
  • Buried Vias (.008” hole)

  • Blind Vias (sequential lamination) (.010” hole) .008”

  • Sequential lamination 4 lamination cycles

  • Via Fill

    • Silver Epoxy (CB100)
    • Resin Fill
  • Impedance

  • Reverse Pulse Plating

  • Flying Probe ET

  • Component Assembly (Thru hole & SMT, BGA, ESD, Conformal Coat)

  • In-Circuit Test (Gen Rad) Flying Probe

  • Environmental Test HASS and HALT

  • Chassis Build

  • Final Finishes HASL, ENIG and Electrolytic Gold

  • Engineering Software Implemented “Genesis” Software ODB++ automation

  • Certifications AS9100, IPC6013, IPC6012, MIL-P-50884, J-STD-001

  • Multi-angle X-Ray (5 axis)

    • XRT Drill/X-Ray system

Materials Used

  • Rigid

    • Epoxy (Fr4/High Tg FR4)
    • Polyimide
    • Isola
    • Arlon
    • Panasonic (Megtron 6)
    • Rogers (4350, 4450)
  • Flexible

    • Dupont Pyralux Series (AP, FR, LF, HT, TK)
    • Taconic (fastPrise EZ)
Let's Talk about your flexible circuit needs

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