The below listed characteristics of MDP - N make this line the perfect product for High Pressure/High Temperature applications, semiconductor and microelectronics applications. MDP(N) is also used in abrasive wheel fabrication and high precision lapping and polishing applications. Available in multiple particle sizes ranging from 25nm up to 30/40 mesh, each nominated size with a tightly held particle size distribution through stringent grading and oversize control.
- Tight particle size distribution
- Blocky and etched surface
- Stringent oversize control
- Surfaces cleaned to extremely low levels of elemental impurities and ionic content
- Specific feed crystal source and monitoring
- Majority of sizes are from our proprietary Mesh-to-Micron process